• butterfly package
  • Butterfly Package Model:FOF
    HERMETICALLY SEALED BUTTERFLY PACKAGE HOUSING

Introduction
Relevant

Microelectronic and Optoelectronic Package Solution

Hermetic packages are used for opto-electronic components and micro electro-mechanical systems(MEMS) to protect the internal components from potentially corrosive or otherwise damaging elements such as water vapor and oxygen.

Nowdays, microelectronics and optoelectronics have became the most important application field in our life. The assembly and packaging is key element to whole product development. We would be pleased to serve you with various kinds of package housing.

photonic package

Notes:
Hermeticity: ≤1×10-3Pa.cm3/s(He)
Insulation Resistance: ≥1×1010Ω  at 100V DC
Thickness of Ni /Au plated: 2.5μm /1.3μm
Plating Quality: No blisters on Au after 3 min(in air) at 400℃
Window: Sapphire, AR coated on both side
Standard: MIL-STD-883, Telecordia

hermetic seal butterfly package

 

Copyright © 2012 - 2019 Zheng Zhou Kiegoo Photonics Technology Co., Ltd.  All rights reserved.  

Powered by PageAdmin CMS